GIGABYTE G894-SD3-AAX7
Артикул: G894-SD3-AAX7
GIGABYTE G894-SD3-AAX7
GPU-платформа G894-SD3-AAX7
GPU-платформа GIGABYTE G894-SD3-AAX7. HPC/AI Server - Intel® Xeon® 6700/6500-Series Processors - 8U DP NVIDIA HGX™ B300
Форм-фактор
8U Rackmount
Процессоры
Intel® Xeon® 6 Processors - Intel® Xeon® 6700-Series Processors - Intel® Xeon® 6500-Series Processors Dual processors, TDP up to 350 W [Note] If only 1 CPU is installed, some PCIe or memory functions might be unavailable.
Память
32 x DIMM slots Support DDR5 RDIMM/MRDIMM [1] 8-Channel memory per processor RDIMM: Up to 6400 MT/s (1DPC), 6000 MT/s (2DPC) MRDIMM: Up to 8000 MT/s [1] MRDIMMs are supported only on select Intel® Xeon® 6 processors with P-cores and only in a 1DPC configuration.
GPU
NVIDIA HGX™ B300 with 8 x SXM GPUs
Compute And Memory
Вычислительная платформа и память
Intel® Xeon® 6 Processors - Intel® Xeon® 6700-Series Processors - Intel® Xeon® 6500-Series Processors Dual processors, TDP up to 350 W [Note] If only 1 CPU is installed, some PCIe or memory functions might be unavailable.. 32 x DIMM slots Support DDR5 RDIMM/MRDIMM [1] 8-Channel memory per processor RDIMM: Up to 6400 MT/s (1DPC), 6000 MT/s (2DPC) MRDIMM: Up to 8000 MT/s [1] MRDIMMs are supported only on select Intel® Xeon® 6 processors with P-cores and only in a 1DPC configuration.
GPU And Expansion
Ускорители и слоты расширения
NVIDIA HGX™ B300 with 8 x SXM GPUs. 4 x FHHL x16 (Gen5 x16), from PEX89072
Storage And Infrastructure
Накопители, сеть и питание
Front hot-swap: 8 x 2.5" Gen5 NVMe - (NVMe from PEX89072) Internal M.2: 1 x M.2 (2280/22110), PCIe Gen5 x4, from CPU_1 1 x M.2 (2280/22110), PCIe Gen5 x2, from CPU_1. Front (I/O board): 2 x 10 Gb/s LAN (1 x Intel® X710-AT2) - Support NCSI function 1 x 10/100/1000 Mb/s Management LAN Rear: 8 x 800 Gb/s OSFP XDR InfiniBand or dual 400 Gb/s Ethernet, for GPU networking, via NVIDIA ConnectX®-8 SuperNIC™ Rear (MLAN board): 1 x 10/100/1000 Mb/s Management LAN [Note] When both MLAN ports are connected with cables, the front MLAN port will be set as the default.. 12 x 3000 W 80 PLUS Titanium redundant power supplies [1] AC Input: - 115-127V~/ 14.2A, 50-60Hz - 200-220V~/ 15.8A, 50-60Hz - 220-240V~/ 14.9A, 50-60Hz DC Input: (Only for China) - 240Vdc/ 14A DC Output: - Max 1450W/ 115-127V~ +54V/ 26.6A +12Vsb/ 3A - Max 2900W/ 200-220V~ +54V/ 53.4A +12Vsb/ 3A - Max 3002.4W/ 220-240V~ or 240Vdc Input +54V/ 55.6A +12Vsb/ 3A [1] The system power supply requires C19 power cord.
Product Details
Детали конструкции
Характеристики
| Сеть | Front (I/O board): 2 x 10 Gb/s LAN (1 x Intel® X710-AT2) - Support NCSI function 1 x 10/100/1000 Mb/s Management LAN Rear: 8 x 800 Gb/s OSFP XDR InfiniBand or dual 400 Gb/s Ethernet, for GPU networking, via NVIDIA ConnectX®-8 SuperNIC™ Rear (MLAN board): 1 x 10/100/1000 Mb/s Management LAN [Note] When both MLAN ports are connected with cables, the front MLAN port will be set as the default. |
|---|---|
| Видео | Integrated in ASPEED® AST2600 - 1 x VGA port |
| Сокет | 2 x LGA 4710 Socket E2 |
| Память | 32 x DIMM slots Support DDR5 RDIMM/MRDIMM [1] 8-Channel memory per processor RDIMM: Up to 6400 MT/s (1DPC), 6000 MT/s (2DPC) MRDIMM: Up to 8000 MT/s [1] MRDIMMs are supported only on select Intel® Xeon® 6 processors with P-cores and only in a 1DPC configuration. |
| Чипсет | System on Chip |
| Накопители | Front hot-swap: 8 x 2.5" Gen5 NVMe - (NVMe from PEX89072) Internal M.2: 1 x M.2 (2280/22110), PCIe Gen5 x4, from CPU_1 1 x M.2 (2280/22110), PCIe Gen5 x2, from CPU_1 |
| Процессоры | Intel® Xeon® 6 Processors - Intel® Xeon® 6700-Series Processors - Intel® Xeon® 6500-Series Processors Dual processors, TDP up to 350 W [Note] If only 1 CPU is installed, some PCIe or memory functions might be unavailable. |
| Форм-фактор | 8U Rackmount |
| Модульные GPU | NVIDIA HGX™ B300 with 8 x SXM GPUs |
| Блоки питания | 12 x 3000 W 80 PLUS Titanium redundant power supplies [1] AC Input: - 115-127V~/ 14.2A, 50-60Hz - 200-220V~/ 15.8A, 50-60Hz - 220-240V~/ 14.9A, 50-60Hz DC Input: (Only for China) - 240Vdc/ 14A DC Output: - Max 1450W/ 115-127V~ +54V/ 26.6A +12Vsb/ 3A - Max 2900W/ 200-220V~ +54V/ 53.4A +12Vsb/ 3A - Max 3002.4W/ 220-240V~ or 240Vdc Input +54V/ 55.6A +12Vsb/ 3A [1] The system power supply requires C19 power cord. |
| Задняя панель | 8 x OSFP ports MLAN board: 1 x MLAN port |
| Передняя панель | I/O board: 2 x USB 3.2 Gen1 ports (Type-A) 1 x VGA port 2 x RJ45 ports 1 x MLAN port (default) 1 x Power button with LED 1 x ID button with LED 1 x NMI button 1 x Reset button 1 x Storage activity LED 1 x System status LED |
| Габариты упаковки | 1200 x 800 x 620 mm |
| Комплект поставки | 1 x G894-SD3-AAX7 2 x CPU heatsinks 4 x Carriers 1 x L-shape Rail kit |
| Материнская плата | MSB4-PE2 |
| Номера исполнения | - Barebone with NVIDIA module: 6NG894SD3DR000AAX7* - Motherboard: 9MSB4PE2UR-000* - L-shape Rail kit: 25HB2-UM6100-K0R - Front panel board - CFPG440: 9CFPG440NR-00* - Backplane board - CBPG641: 9CBPG641NR-00* |
| Слоты расширения PCIe | 4 x FHHL x16 (Gen5 x16), from PEX89072 |
| Габариты (Ш x В x Г), мм | 8U 447 x 351 x 923 |
| Модули безопасности | 1 x TPM header with SPI interface - Optional TPM 2.0 kit: CTM012 |
| Условия эксплуатации | Operating temperature: 10°C to 30°C Operating humidity: 8% to 80% (non-condensing) Non-operating temperature: -40°C to 60°C Non-operating humidity: 20% to 95% (non-condensing) |
| Системные вентиляторы | Motherboard: 2 x 60x60x56mm 4 x 60x60x76mm OSFP ports: 4 x 40x40x56mm PCIe slots: 2 x 80x80x56mm GPU tray: 15 x 80x80x80mm |
Характеристики приведены по данным производителя и могут быть изменены без предварительного уведомления.
GIGABYTE Enterprise
Документация и поддержка
Актуальные руководства, драйверы, прошивки и списки совместимости для точного исполнения G894-SD3-AAX7 опубликованы производителем.
Ссылки ведут только на официальный домен GIGABYTE. Производитель может обновлять файлы и перечни совместимости без предварительного уведомления.
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